Solder Paste
Multi-feature Halogen-free Solder Paste for fine-pitch printing
- S3X70-HF1200
S3X70-HF1200 performs optimal solderability with micro-components (0402 metric chip, 0.4mm pitch BGA, etc.). It is a multi-feature solder paste which solves various soldering issues. S3X70-HF1200 is a highly functional solder paste which can handle different soldering issues, such as void, wettability, flux splattering, printability and electrical reliability while complying halogen-free standard. Low-void performance and high-wettability performance is exceptional that this solder paste can deliver surface mount quality in the highest level.
feature
- Multiple features including, ultra low voiding and powerful wetting, etc.
- Ensures excellent solderability for micro components (0402 metric chips, 0.4mm pitch BGA) without the need for N2 reflow
- Enables to reduce manufacturing costs by switching from N2 to air atmosphere
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S3X70-HF1200
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
10 - 25
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Flux Content（%）
12.5
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Viscosity（Pa.s）
190
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004D)
0402 (metric) chip can be soldered using air atmosphere!
In micro-components soldering, N2 reflow was required, as the finer solder powder gets, the larger surface area becomes.
With S3X70-HF1200’s flux technology, good wettability is provided that 0402 metric chip can be soldered in air atmosphere without any unmolten solder powder.
■Air atmosphere soldering test
Excellent printability at fine-pitch pads
S3X70-HF1200 can be used in micro-components. Stable high transfer ratio at fine-pitch pads can be maintained throughout the continuous printing.
■ Continuous printability test results
Improved processibility
S3X70-HF1200 flux has improved intermittent printability. It can provide good print results after 60 minutes pause. Even if the printing process has halted for equipment trouble or stencil change over, printing process can be resumed smoothly without the need for test prints.
■ Intermittent printability test results (CSP pad)
Struggling with Voiding or Wettability?
With advancements in PCB and component quality and performance in SMT industry, the demands on solder materials have also increased.
In response to the industry’s growing need to address voiding and wettability challenges, we have newly developed a unique product featuring two groundbreaking technologies, the ‘2-Step Flux Gas Discharge Effect’ and ‘2-Step Activation Boost Effect’ delivering unprecedented level of assembly quality!
What is “the Dual 2-step Technology”? – S3X58-HF1200
Low-Void Solder Joint by Air Atmosphere Reflow regardless of Component Type and Size
Flux gas discharge effect can form low-void solder joint with void prone component, such as component with bottom electrode.
Consistent soldering quality can be obtained regardless of the size of component and the surface finish of the component electrode.
■Void condition by different components
Addresses various surface mounting challenges
The performance required in a soldering material for surface mount assembled products has become higher in terms of quality and function.
The flux used in S3X70-HF1200 is unique with KOKI selecting a flux which fulfills versatile requirements using a newly introduced core technology.
HF1200 is available in following variations.
The HF1200 series
・S3X58-HF1200 Multi-feature Halogen-free Solder Paste (SAC305 / Type 4)
・S1XBIG58-HF1200B Low-Cost High Reliability Solder Paste (1.1Ag / Type 4)
・S01XBIG58-HF1200B Super Low-Cost High Reliability Solder Paste (0.1Ag / Type 4)
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.