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Halogen-free Tack Flux for PoP application / 3D assembly

  • TF-MP2
Halogen-free Tack Flux for PoP application / 3D assembly

TF-MP2 is used for transfer applications, ensuring high PoP mounting quality by stabilizing the solder paste transfer amount and addressing a key challenge in PoP applications. Additionally, it maintains the deposit shape for an extended period by optimizing the thixotropic agent.

feature

  • Maintains high transfer rates even with continuous use
  • Ensures stable transfer and rolling properties
  • Minimizes oxidation of BGA balls and prevents the formation of head-in-pillow defects
  • Achieves high reliability after soldering
  • Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)

Product Performance Table

  • Product name

    TF-MP2

  • Method of Application

    Transfer

  • State / Color

    Amber color

  • Viscosity(Pa.s)

    10

  • Halide content(%)

    0

  • Flux Type

    ROL0 (IPC J-STD-004A)

Long-lasting transfer quality

Refining thixotropic agents allowed TF-MP2 to maintain the transferred shapes intact for a long period of time. Consistent transfer quality and rolling quality are achieved.

◾️BGA image

Swift solder spreading and assured melting

◾️Wetting speed test(Koki original method)

Wetting speed is improved to achieve speedy spreading. TF-MP2 ensures swift melting of solders during PoP assembly.

Improved heat resistance prevents joint defects

Oxidation of BGA balls during pre-heating is minimized, and solder swiftly melts and spreads after reaching the melting point. Joint defects are prevented by letting BGA components settle down at once.

◾️Anti-pillow test(Heat resistance test)

Contact Us

For any requests for estimates, product information, technical questions, etc. please reach out to us.