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Halogen-free Tack Flux for PoP application / 3D assembly
- TF-MP2

TF-MP2 is used for transfer applications, ensuring high PoP mounting quality by stabilizing the solder paste transfer amount and addressing a key challenge in PoP applications. Additionally, it maintains the deposit shape for an extended period by optimizing the thixotropic agent.
feature
- Maintains high transfer rates even with continuous use
- Ensures stable transfer and rolling properties
- Minimizes oxidation of BGA balls and prevents the formation of head-in-pillow defects
- Achieves high reliability after soldering
- Complies with Halogen Free standard (BS EN14582, Br+Cl < 1,500 ppm)
Product Performance Table
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Product name
TF-MP2
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Method of Application
Transfer
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State / Color
Amber color
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Viscosity(Pa.s)
10
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Halide content(%)
0
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Flux Type
ROL0 (IPC J-STD-004A)
Long-lasting transfer quality
Refining thixotropic agents allowed TF-MP2 to maintain the transferred shapes intact for a long period of time. Consistent transfer quality and rolling quality are achieved.
◾️BGA image

Swift solder spreading and assured melting
◾️Wetting speed test(Koki original method)

Wetting speed is improved to achieve speedy spreading. TF-MP2 ensures swift melting of solders during PoP assembly.
Improved heat resistance prevents joint defects
Oxidation of BGA balls during pre-heating is minimized, and solder swiftly melts and spreads after reaching the melting point. Joint defects are prevented by letting BGA components settle down at once.
◾️Anti-pillow test(Heat resistance test)

Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.