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Vacuum Reflow
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What is vacuum reflow process?
Conventionally, mainstream for reflow atmosphere was air atmosphere or N2 atmosphere. However, introduction of vacuum soldering has increased along with the growing demand for low-void solder joint.
Introduction of vacuum soldering is increasing not only in power device assembly but also in automotive and electric device assembly.
Market demand
Void is one of the issues associated with the use of solder paste.
When selecting a bottom bonding component, void is one of the criteria to judge good/ no good solder joint. Although the required void level depends on the company and products, low void solder joint is a common ground.
Void in heatsink pad
Components with heat radiation feature is becoming popular. Since the void in solder joint is considered to affect the heat radiation performance, low void solder joint is preferred.
Void in module component
Module component manufacturers produce nested module which will be reflowed by their customer. If there were void in the nested module, second reflow may cause void to grow and deteriorate the solder joint reliability. Therefore, they require low void solder joint.
Solder characteristics required in vacuum reflow
Prevent splattering and solder ball
In a vacuum reflow process, decompression is implemented once the solder is molten. In this process, flux splattering or solder ball may occur. If excessive amount of flux splattering or solder ball occurred, reflowed PCB could require a cleaning.
By using a solder paste with a flux specifically designed for vacuum reflow, flux splattering or solder ball can be reduced.
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