Requirement
Flux residue cleaning compatibility
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Necessity for flux residue cleaning
Flux residue from soldering process needs to be cleaned in following cases.
- Ensure good insulation resistance (eliminate ionic substance)
- Corrosion prevention (chemical reaction by high temperature, high humidity or bias voltage)
- Prevent connectivity error (insulator remaining in connector contact area)
- Pin contact response (improve test response, reliability interference)
- Solder balls
- Preparation for automated optical inspection (AOI)
- Preparation for coating agent
Regarding flux residue reliability—such as ensuring insulation reliability and preventing corrosion—it is fundamentally guaranteed even in our no-clean product designs.
However, depending on the customer’s specific operating conditions, such as pin contact properties or AOI (Automated Optical Inspection) requirements, product customization may be necessary.
Challenges regarding flux residue cleaning
By adding highly active substance in the solder paste to ensure good meltability of the oxidized metal, its flux residue would contain a lot of metallic salt. Metallic salt would not be dissolved by flux residue cleaning agent and reduces cleanability of the flux residue. Therefore, it is necessary to alter the design so that the flux residue swells easily with the cleaning agent, ensuring good cleaning performance even when metal salts are present in the residue.
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