Solder Paste
Solder paste for Package on Package application / 3D assembly
- NT2 series
NT2 series ensure high PoP mounting quality by stabilizing the solder paste transfer amount onto the component solder bumps, addressing a key challenge in PoP applications. It is also designed to enhance the heat resistance and activation of the flux to prevent HiP(Head-in-Pillow) defects caused by component warpage.
feature
- Maintains a consistent transfer rate even during continuous use
- Inhibits HiP defects caused by component warpage
- Available in various powder sizes (IPC type 5-6) for versatile applications
- Complies with Halogen Free standard (BS EN14582, Br+Cl: 0ppm)
Product Performance Table
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Product name
NT2 series
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Composition
Sn 3.0Ag 0.5Cu
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Melting Point（℃）
217 - 219
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Particle Size（μm）
70: 10 - 25 / 811: 5 - 20
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Flux Content（%）
70: 20.2 / 811: 20.0
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Viscosity（Pa.s）
25
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Halide content（%）
0
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Flux Type
ROL0 (IPC J-STD-004A)
Consistent transfer volume maintained even during continuous use.
We have achieved stabilization of transfer volume, addressing a major challenge in PoP transfer.
The NT2-series has reliable PoP mounting with minimal variation in transfer height and consistent transfer volume, even after long time use.
Prevents pillow defects caused by thermal warpage of components
During reflow, package and board warping can cause the bumps and paste to separate, leading to surface oxidation and joining defects.
The NT2 Series enhances heat resistance and flux activation, effectively preventing the joining defects commonly encountered in PoP mounting.
Various solder powder sizes are available
The selection of two solder powder sizes (IPC-Type 5 & 6) is ideal for further downsizing and diversification of packages.
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.