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ICT testable no-clean / cleanable Low Cost High Reliability Solder Paste (1.1Ag)
- S1XBIG58-M650-7
The BIG series is a high reliability alloy with improved thermo-mechanical stress durability using unique alloy strengthening technologies, while realizing a reduced low silver content (1.1% Ag), offering lower material costs. Its thermal cycle resistance and joint strength exceed SAC305. Innovatively engineered, the low stickiness of the flux residue prevents adhesion to test pins, improving ICT first pass yield. It also offers excellent cleanability, making it suitable for both no-clean and clean applications.
feature
- Thermal cycle resistance and joint strength exceed SAC305, despite reduced silver content.
- Enables to use the same reflow profile as SAC305
- Specially designed flux for improved ICT testability
- Easy to eliminate the flux residue with cleaning materials and equipment
- Halogen free, no artificial addition of any halogen element
Product Performance Table
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Product name
S1XBIG58-M650-7
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Composition
Sn 1.1Ag 0.7Cu 1.8Bi +Ni
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Melting Point(℃)
211 - 223
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Particle Size(μm)
20 - 38
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Flux Content(%)
11.2
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Viscosity(Pa.s)
200
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Halide content(%)
0
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Flux Type
ROL0 (IPC J-STD-004B)
High ICT first pass yield
S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint,
which helps the testing probe to get the accurate readings to improve the first pass rate.。
Superior wetting ability prevents voiding
For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S1XBIG58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.
“Halogen-free”addressing the environment
One keyword of environmental measures is “halogen-free”; these days companies demand final products to be halogen-free.
Halogen-free S1XBIG58-M650-7 meets such demands while providing both reliability and workability.
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.