What is package-on-package (PoP) and 3D-MID mounting

PoP is a technology intended to increase the density of surface mounting by stacking the IC packages instead of arranging them 2-dimensionally. By stacking packages, packages with different functions can be combined.

3D-molded interconnect device (3D-MID) is a device which has electrode or circuit fabricated on the surface of 3-dimensionally molded component.
This is a technology which makes light-weight and low-profile product by reducing the number of components mounted on a printed circuit board (PCB) or flexible printed circuits (FPC), and it embodies new design by increasing adaptability of the shape of an electronic product.

Pros for PoP or SD-MID assembly

PoP is a surface mounting technology mainly used in mobile devices as it allows the PCB to be more high-density and high-integrated. It also allows users to choose the combination of memory and processor more easily, which offers more flexibility to the users.

3D-MID is a technology which reduces footprints occupied by the assembled PCB inside a product casing or ease the constraints in designing the product casing to hold an assembled PCB. Traditionally, PCB or FPC was used to incorporate wiring or electric components; however, 3D-MID allows them to be constructed on the surface of resin molded product casing, etc. 3D-MID technology allows processes previously available only in 2D, such as circuit fabrication and electronic component mounting, to be performed in 3D. As a result, product design can be more versatile: A flat electronic product may be designed in a complexed 3D structure or may be thinner and more lightweight.

PoP/ 3D-MID technology instances

High-density and high-integrity soldering PCB

PoP/ 3D-MID technology is utilized in assembling PCBs which requires miniaturization and high-density mounting, such as mobile phone, portable music player or GPS device to reduce the footprint occupied by IC packaging.

Mounting PCB (circuit) in a narrow or irregularly shaped casing

To improve design flexibility and device performance, PCB (circuit) is integrated and converted into 3D structure by utilizing PoP and 3D-MID technology.