Requirement
Micro-pattern Applications
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Micro-pattern Applications
In SMT industry, the most popular chip component size has been 0603 (metric). While mobile components increase its functionality, it is also miniaturized, surface mount boards are more densely populated by micro-components, and 0402 (metric) chip components are becoming more prevalent. In addition, ultra-micro components, such as 03015, 0201 (metric) components have been developed for electric modules.
Although the application of these ultra-micro components are limited to mobile devices such as Bluetooth® or GPS module, its demand is expected to grow as more electric modules are miniaturized.
■ Trend of the ceramic capacitor size
Demand for compatible material
In fine-pitch designs, the size of solder powders in solder paste must be smaller according to the chip size and aperture diameter. In general, recommended solder powder size is less than 1/8~1/10 of the aperture diameter.
Issues with micro-components soldering
Printing
Solder powder’s surface area increases when the solder powder size decreases. Larger surface area increases shear resistance against the inner wall of the stencil aperture and causes the stencil to take significant amount of solder powders at the stencil release timing. This could induce low print transfer defect.
Reflowing
Increased solder powder’s surface area means increased metal oxide on their surface. As a result, meltability will be deteriorated, and solder powder will remain unmolten after the reflow.
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