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Low-Voiding
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What is a void?
Voids are spaces inside the solder joint which is induced by “bubble” “de-wetting” and “poor bubble release.
Void could mean any of the list below
- Void in bulk solder
- Void from de-wetting
- Void near a solder joint interface
- Void at micro-via
- Pin hole (blow hole)
- Kirkendall void
Demand for low-void solder joint
Void reduces the cross-sectional area and deteriorates the heat conduction and electrical conductivity. In addition, it reduces the solder joints’ bond strength and functionality which could have negative impact on solder joint reliability. Therefore, it is desirable to have low-void soldering process to keep void occurrence as little as possible.
Void mechanism
Void can be reduced by reducing the amount of the bubble produced upon solder melting, by improving solder’s wettability or by promoting bubble release upon solder melting.
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