Requirement
Clack-free flux residue
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What is clack-free flux residue?
Assembled PCBs are frequently exposed to severe operating environments involving extreme temperature fluctuations, which can lead to moisture condensation on the board surface—often directly on top of flux residues. If these flux residues crack due to external impact, vibration, or thermal cycling, moisture can penetrate the cracks. This trapped moisture degrades the insulation resistance of the circuitry and can ultimately trigger electrical short circuits caused by electrochemical migration.
■ Crack occurred on flux residue after thermal-cycling
Moisture penetration and migration occurrence
Dew cycle test(Condensation on flux residue)
Countermeasures against condensation
It is expected that the ECU in automobile will be more sophisticated and grow in number, so that required electrical reliability of the flux residue will also be higher. Besides automotive industry, electronic devices for outdoor use or industrial equipment has high electrical reliability requirements and demands flux residue to be crack-free under harsh working environment such as huge temperature/ humidity difference.
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