Requirement
High-Reliability
Pick up articles
Table of contents
What is a high-reliability solder?
High-reliability solder alloy can form a solder joint with a higher bond strength than the popular lead-free solder alloy SAC305 (S/n3.0 Ag/0.5Cu). It contains strengthening elements as additive to improve the durability and there are different alloy compositions.
Issues with SAC305
Automotive components and industrial machineries are exposed to harsh working environment; therefore, they are subject to harsh thermal-cycling test conditions. As a result, SAC305 does not have sufficient durability. Solder joint experiences repeated shear stress due to thermal expansion during heat cycles. Shear stress induces metal fatigue and causes solder joint crack.
■Schematic image of crack in chip solder joint dur to thermal-cycling
Market demand
Products operate under harsh condition, such as high or low temperature requires higher solder joint reliability. High-reliability solder maintains high bond strength under harsh condition and extends product life.
Keywords / Related articles
Contact Us Inquiry
For any requests for estimates, product information, technical questions, etc. please reach out to us.