Requirement
Low Curing Temperature Adhesive
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What is low-temperature curing?
Curing temperature of popular thermo-setting adhesive is in middle temperature range; 130~150˚C. There is also adhesives for temperature sensitive components which cures below 100˚C, known as low-temperature curing adhesive.
Market demand for low-temperature curing adhesive
When temporarily fixing components on double-sided PCB soldering, components with high heat resistance are fixed on the PCB using SMT adhesive at the same time with reflow soldering. If the wave soldering is the main soldering process and the assembly is comprising from low-heat resistant components or paper phenol PCB, adhesive is also required to be low-temperature curing. KOKI’s low-temperature curing adhesive cures below 100˚C and can reduce thermal damage to the components.
■ Typical curing profile
Benefit of low-temperature curing adhesive
Low energy consumption and energy cost, CO2 reduction
By using low-temperature curing adhesive, components and PCBs with low temperature resistance (e.g. paper phenol board) can be used and cost reduction can be achieved. In addition, temperature setting of the reflow and wave soldering equipment can be lower, which contributes to reduce energy consumption and power bills, and contributes to CO2 reduction (carbon neutral).
■ Hourly energy consumption of curing oven
Prevent component and PCB from oxidized
By using low-temperature curing adhesive, the sum of the heat on the component and PCB during the wave soldering can be reduced, which prevents solder joint defect due to oxidation on metal surfaces and PCB’s thermal warpage.
■ Thermal profile image of the components and PCB
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